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 ICs for Consumer Electronics
SDA 525X to SDA 525X-2 V2.0
Delta Specification V2.0
1998-10-08
SDA 525X to SDA 525X-2 Revision History: Previous Version: Page Page (in previous (in current Version) Version) 4, 5 4, 5 14 18 19 15 17 4, 5 4, 5 14 21 22 Current Version: 1998-10-08 1998-03-10 Subjects (major changes since last revision)
"VS sampling" inserted "RGB and blanking skew" inserted SDA 5254-57-2 with 10 pages optional Also SDA 5253-2 available Hardware compatibility, topics 5 to 8 added Timing changed to 18 MHz Changes in application circuit (Iref, CVBS, FIL3)
Edition 1998-10-08 Published by Siemens AG, Bereich Halbleiter, MarketingKommunikation, Balanstrae 73, 81541 Munchen (c) Siemens AG 1998. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express written approval of the Semiconductor Group of Siemens AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
SDA 525X-2
Table of Contents 1 2 3 4 4.1 4.2 4.3 4.4 5 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 7 7.1 8 9 10
Page
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Complete Feature List Including New Features . . . . . . . . . . . . . . . . . . .4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 P-MQFP-80-1, ROMless-Version (top view) . . . . . . . . . . . . . . . . . . . . . . . .7 P-LCC-84-2, Emulator-Version (top view) . . . . . . . . . . . . . . . . . . . . . . . . . .8 P-SDIP-52-1, ROM-Versions (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . .9 P-MQFP-64-1, ROM-Versions (top view) . . . . . . . . . . . . . . . . . . . . . . . . .10 Pin Correspondence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Differences of SDA 525x-2 Compared to SDA 525x . . . . . . . . . . . . . . .14 Hardware-Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Software-Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Improved Performance Sync- and Data-Slicer . . . . . . . . . . . . . . . . . . . . .14 Crystal-locked Display-PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Improved Interface to External RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 No UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 VS Sampling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 RGB and Blanking Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Registers of SDA 525x-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Address Space of SDA 525x-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Software Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Semiconductor Group
3
1998-10-08
SDA 525X-2
1
General Description
As its predecessors SDA 525x the SDA 525x-2 contains a slicer for VPS and TTX, an accelerating acquisition hardware module, a display generator for "Level 1.5" TTX data, and an 8 bit microcontroller running at 333 ns cycle time. The controller with dedicated hardware guarantees flexibility, does most of the internal processing of TTX acquisition, transfers data to/from the external memory interface and receives/transmits data via I2C user interface. The block diagram shows the internal organization of the SDA 525x-2. The slicer combined with dedicated hardware stores TTX data in a VBI buffer of 746 Byte. The microcontroller firmware performs all the acquisition tasks (hamming- and parity-checks, page search and evaluation of header control bits) once per field. This delta specification describes the differences of the SDA 525x-2 compared to the SDA 525x as described in the preliminary data sheet 1997-09-01. 2 Complete Feature List Including New Features
New features compared to SDA 525x-Specification, version 06/96 are printed in italic and bold. As described in the errata sheet 03/97, release 1.0, the newer versions of the SDA 525x and the SDA 525x-2 will not have a serial port (UART) any more. * Acquisition: - Feature selection via special function register - Simultaneous reception of TTX, VPS, and WSS - Fixed framing code for VPS and TTX - Acquisition during VBI - Direct access to VBI RAM buffer - Acquisition of packets x/26, x/27, 8/30 (firmware) - Assistance of all relevant checks (firmware) - 1-bit framing code error tolerance (switchable) * Display: - Features selectable via special function register - 50/60 Hz display (optional 100 Hz) - Level 1.5 serial attribute display pages - Blanking and contrast reduction output - 8 direct addressable display pages for SDA 5250-2, SDA 5254-2 to SDA 5257-2 (optional 10 pages) - 1 direct addressable display page for SDA 5251-2 to SDA 5253-2 - 12 x 10 character matrix - 96 character ROM (standard G0 character set) - 156 national option characters for 12 languages (for European version) - 288 characters for X/26 display - 64 block mosaic graphic characters - 32 characters for OSD in expanded character ROM + 32 characters inside OSD box
Semiconductor Group
4
1998-10-08
SDA 525X-2
*
*
* * * *
- Conceal/reveal - Transparent foreground/background - inside/outside of a box - Contrast reduction inside/outside of a box - Cursor (color changes from foreground to background color) - Flash (flash rate 1s, not depending on field rate) - Programmable horizontal and vertical sync delay - Full screen background color in outer screen - Double size/double width/double height characters Synchronization: - Display synchronization to sandcastle or Horizontal Sync (HS) and Vertical Sync (VS) Microcontroller: - 8 bit C500-CPU (8051 compatible) - CPU-clock 18 MHz, external 6-MHz-crystal - 333 ns instruction cycle - Parallel 8-bit data and 16 ... 19-bit address bus (ROMless-Version) - Eight 16-bit data pointer registers (DPTR) - Two 16-bit timers - Watchdog timer - Capture compare timer for infrared remote control decoding - 256 bytes on-chip RAM - 8 KByte on-chip display-RAM (access via MOVX) SDA 5250-2, SDA 5254-2 to SDA 5257-2 (optional 10 Kbyte) - 1 Kbyte on-chip display-RAM (access via MOVX) for SDA 5251-2 to SDA 5253-2 - 1 Kbyte on-chip ACQ-buffer-RAM (access via MOVX) - 1 Kbyte on-chip extended-RAM (access via MOVX) for SDA 5250-2 and SDA 5254-2 to SDA 5257-2 - 6 channel 8-bit pulse width modulation unit - 2 channel 14-bit pulse width modulation unit - 4 multiplexed ADC inputs with 8-bit resolution - One 8-bit I/O port with open drain output and optional I2C-Bus emulation - Two 8-bit multifunctional I/O ports - One 4-bit port working as digital or analog inputs - One 3-bit I/O port with optional RAM/ROM address expansion up to 512 Kbyte (ROMless-Version) P-SDIP-52-1/P-MQFP-64-1 package for ROM-Versions (SDA 5251-2 to SDA 5253-2, SDA 5254-2 to SDA 5257-2) P-MQFP-80-1 package for ROMless-Version (SDA 5250M-2) P-LCC-84-2 package for Emulator-Version (SDA 5250-2) 5 V supply voltage
Semiconductor Group
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1998-10-08
SDA 525X-2
3
Block Diagram
VS HS/SC
Capture Compare Timer TTC Watchdog Timer ADC PWM TTX, VPS Slicer TTD Acquisition Character ROM 448*12*10 Display Timing Display Generator R G B BLAN COR
CVBS FIL3 I REF
2)
C500 CPU (8051-comp.) incl. Timer 0/1 256 Kbyte
3)
1)
Memory Management Unit (MMU)
Extended Data RAM 1 Kbyte
Program Memory ROM
Dual Port Interface
Dual Port Interface
4)
VBI Buffer 1 Kbyte
Display RAM
RD, WR PSEN, ALE D(7:0) A(16:0) P4.1(A18), P4.0(A17)
P3 P2 P1 P0 XTAL1, XTAL2
1) 2)
Only ROM-versions Only ROMless-version 3) Only SDA 5250-2 and SDA 5254-2 to SDA 5257-2 4) 8 K (opt. 10 K) byte for SDA 5250-2 8 K for SDA 5254-2 to SDA 5257-2 1 Kbyte for SDA 5251-2 and SDA 5252-2
UES09854
Figure 1
Differences compared to SDA 525x according to preliminary specification 06/96: 1. UART is not supported. 2. RGB-outputs deliver a current instead of a voltage. 3. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions. 4. LCIN and LCOUT are not needed any more.
Semiconductor Group
6
1998-10-08
SDA 525X-2
4 4.1
Pin Configuration P-MQFP-80-1, ROMless-Version (top view)
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P0.5 P0.6 P0.7 P2.3 P2.2 P2.1 P2.0 VSSA FIL3 N.C. N.C. VDDA I REF CVBS P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 D5 D0 D6 A0 D7 A1 A2 A10 A3 A4 A11 A5 A9 A6 A8 A7 A13 A12 A14 A15
PSEN P3.1 P3.0 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 VSS VDD XTAL2 XTAL1 RST ALE A17/P4.0 A16 A18/P4.1
P0.4 P0.3 P0.2 P0.1 P0.0 VS/P4.7 HS/SC WR RD VDD VSS COR BLAN B G R D3 D2 D4 D1
SDA 5250M-2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
UEP09855
Figure 2
Differences compared to SDA 525x according to preliminary specification 06/96: 1. RGB-outputs deliver a current instead of a voltage (Pins 45, 46, 47). 2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions (Pin 69). Former FIL1SLC and FIL2SLC remain "not connected" (Pins 70, 71). 3. LCIN and LCOUT are not needed any more and are now used for RD and WR (see 4.) 4. P-MQFP-80-1 now has RD (Pin 52), WR (53) and PSEN (1) Pins to connect external RAM. `n.c.' = `not connected' means: Pins must be left open.
Semiconductor Group 7 1998-10-08
SDA 525X-2
4.2
P-LCC-84-2, Emulator-Version (top view)
P0.6 P0.7 STOP_OCF ENE P2.3/ANA3 P2.2/ANA2 P2.1/ANA1 P2.0/ANA0 VSSA FIL3 N.C. N.C. VDDA I REF CVBS P3.7 P3.6 P3.5 P3.4 P3.3 P3.2
P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 VS/P4.7/ODD-EVEN HS/SC N.C. N.C. VDD VSS COR BLAN B G R D3 D2 D4 D1
53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 D5 D0 D6 A0 D7 A1 A2 A10 A3 PSEN A4 A11 A5 A9 A6 A8 A7 A13 A12 A14 A15
SDA 5250-2
75 76 77 78 79 80 81 82 83 84 1 2 3 4 5 6 7 8 9 10 11
P3.1 P3.0/ODD-EVEN P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 V SS V DD XTAL2 XTAL1 RST WR RD ALE A17/P4.0 A16 A18/P4.1
UEP09856
Figure 3
Differences compared to SDA 525x according to preliminary specification 06/96: 1. RGB-outputs deliver a current instead of a voltage (Pins 37, 38, 39). 2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions (Pin 63). Former FIL1SLC and FIL2SLC remain "not connected" (Pins 64, 65). 3. LCIN and LCOUT are not needed any more and remain "not connected" (Pins 44, 45). `n. c.' = `not connected' means: Pins must be left open.
Semiconductor Group 8 1998-10-08
SDA 525X-2
4.3
P-SDIP-52-1, ROM-Versions (top view)
P3.1 P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 VSS VDD XTAL1 XTAL2 P4.0 RST P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 VSSA FIL3 N.C.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
SDA 5251-2 SDA 5252-2 SDA 5254-2 SDA 5255-2 SDA 5256-2 SDA 5257-2
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27
UEP09857
P3.0 COR BLAN B G R VS/P4.7 HS/SC P3.2 P3.4 P3.5 P3.6 P3.7 N.C. N.C. VDD P3.3 VSS P2.0 P2.1 P2.2 P2.3 CVBS I REF VDDA N.C.
Figure 4
Differences compared to SDA 525x according to preliminary specification 06/96: 1. RGB-outputs deliver a current instead of a voltage (Pins 47, 48, 49). 2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions (Pin 25). Former FIL1SLC and FIL2SLC remain "not connected" (Pins 26, 27). 3. LCIN and LCOUT are not needed any more and remain "not connected" (Pins 38, 39). `n. c.' = `not connected' means: Pins must be left open.
Semiconductor Group
9
1998-10-08
SDA 525X-2
4.4
P-MQFP-64-1, ROM-Versions (top view)
XTAL2
XTAL1 VDD
P1.4
P1.5
P1.6
P1.7
P4.0
P0.0
VDD VSS
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 N.C. P1.3 P1.2 P1.1 P1.0 VSSA FIL3 N.C. N.C. VDDA 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1
P2.0
VSS
P0.1
N.C.
N.C.
RST
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 2 3 4 5 6 7
N.C.
N.C. P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P3.1 P3.0 COR BLAN B G R VS/P4.7 N.C.
I REF
CVBS P2.3 P2.2 P2.1 N.C.
SDA 5251M-2 SDA 5252M-2 SDA 5254M-2 SDA 5255M-2 SDA 5256M-2 SDA 5257M-2
8
N.C.
9 10 11 12 13 14 15 16
N.C. N.C. P3.5 P3.2 HS/SC P3.7 P3.6 P3.4
P3.3 VDD
VSS VSS
VDD
UEP10218
Figure 5
Differences compared to SDA 525x according to preliminary specification 06/96: 1. RGB-outputs deliver a current instead of a voltage (Pins 19, 20, 21). 2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions (Pin 55). Former FIL1SLC and FIL2SLC remain "not connected" (Pins 56, 57). 3. LCIN and LCOUT are not needed any more and remain "not connected" (Pins 7, 8). `n. c.' = `not connected' means: Pins must be left open.
Semiconductor Group
10
1998-10-08
SDA 525X-2
5
Pin Correspondence
Table 1 Pin Correspondence P-SDIP-52-1, P-MQFP-64-1, P-MQFP-80-1, P-MQFP-80-1, P-LCC-84-2
Symbol P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 XTAL2 XTAL1 RST Pin No. Pin No. Pin No. Pin No. Pin No. Changes compared P-SDIP-52-1 P-MQFP-64-1 P-MQFP-80-1 P-MQFP-80-1 P-LCC-84-2 to SDA 525x 9 8 7 6 5 4 3 2 23 22 21 20 19 18 17 16 34 33 32 31 13 12 15 11, 37 10, 35 47 48 49 50 51 52 1 44 36 43 42 41 40 34 33 31 30 29 28 27 26 53 52 51 50 48 47 46 44 1 63 62 61 40 39 42 5, 6, 37, 38 2, 3, 35, 36 19 20 21 22 23 24 25 15 4 14 13 10 9 56 57 58 59 60 61 62 63 11 10 9 8 7 6 5 4 67 66 65 64 14 15 16 13, 51 12, 50 45 46 47 48 49 3 2 80 79 78 77 76 75 58 59 60 61 62 63 64 65 13 12 11 10 9 8 7 6 69 68 67 66 16 17 18 15, 53 14, 52 47 48 49 50 51 5 4 2 1 80 79 78 77 48 49 50 51 52 53 54 55 84 83 82 81 80 79 78 77 61 60 59 58 3 4 5 2, 43 1, 42 37 38 39 40 41 76 75 74 73 72 71 70 69
6 MHz crystal 6 MHz crystal
VDD VSS
R G B BLAN COR P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7
current output current output current output
Semiconductor Group
11
1998-10-08
SDA 525X-2
Table 1 Pin Correspondence P-SDIP-52-1, P-MQFP-64-1, P-MQFP-80-1, P-MQFP-80-1, P-LCC-84-2 (cont'd)
Symbol HS/SC Pin No. Pin No. Pin No. Pin No. P-SDIP-52-1 P-MQFP-64-1 P-MQFP-80-1 P-MQFP-80-1 45 16 18 54 55 56 57 Pin No. Changes compared P-LCC-84-2 to SDA 525x 46 47
VS/P4.7/ 46 ODD-EVEN CVBS 30 29 28 24 25
60 59 58 24 55
74 73 72 68 69
76 75 74 70 71
68 67 66 62 63
New ext. comp. values New ext. comp. values
IREF VDDA VSSA
FIL3
New ext. comp. values, FIL1/2 not needed
P4.0
14
41
18
20
9
LCIN and LCOUT are not needed any longer.
Semiconductor Group
12
1998-10-08
SDA 525X-2
Additional Pin Correspondence P-MQFP-80-1 and P-LCC-84-2 Table 2 Pin Correspondence P-MQFP-80-1, P-MQFP-80-1, P-LCC-84-2 Symbol A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 D0 D1 D2 D3 D4 D5 D6 D7 STOP_OCF ENE RD WR ALE PSEN P4.1 Pin No. Pin No. Pin No. P-MQFP-80-1 P-MQFP-80-1 P-LCC-84-2 37 35 34 32 31 29 27 25 26 28 33 30 23 24 22 21 19 39 41 43 44 42 40 38 36 - - 52 53 17 1 20 39 37 36 34 33 31 29 27 28 30 35 32 25 26 24 23 21 41 43 45 46 44 42 40 38 - - 54 55 19 3 22 29 27 26 24 22 20 18 16 17 19 25 21 14 15 13 12 10 31 33 35 36 34 32 30 28 56 57 7 6 8 23 11 Changes vs. SDA 525x
new for MQFP new for MQFP new for MQFP
Semiconductor Group
13
1998-10-08
SDA 525X-2
6
Differences of SDA 525x-2 Compared to SDA 525x
This delta specification describes the differences of the SDA 525x-2 compared to the SDA 525x as described in the preliminary data sheet 1997-09-01. 6.1 Hardware-Compatibility
TVT-2 is pin-compatible to previous versions of TVT. However, some variations in external components become necessary (see Application Circuit in Chapter 10):
1. The LC-oscillator is not necessary any longer. 2. The filters 1 and 2 are not needed any longer. Only filter 3 is needed but with different external device dimensions. 3. Since the RBG outputs deliver a current, a voltage divider can be replaced by a single resistor (see TVText Design Guide). 4. The external crystal is now 6 MHz instead of 18 MHz. 5. The CVBS-pin needs different dimensioning of the external components due to changes in the internal clamping circuit. 6. The Iref-pin needs different dimensioning of the external components and an additional blocking capacitor. 7. To avoid clock cross-talk and to improve the slicer performance use filter circuits at the power supply pins to decouple digital and analog supplies. 8. Due to a reworked analog concept with the advantage of a more stable circuits and better performance the power consumption has increased. For the Romless version a maximum overall IDD-current of 95mA can be reached, for ROM versions up to 100mA.
Furthermore, the MQFP-80-packages now have RD, WR, and PSEN pins to connect to external RAM. 6.2 Software-Compatibility
Only slight software changes may be necessary due to some register changes (see chapter 7). 6.3 Improved Performance Sync- and Data-Slicer
Due to crystal locked PLLs the robustness of the sync- and data-slicer is improved. 6.4 Crystal-locked Display-PLL
The display clock will be locked to the internal PLL locked to the single external 6-MHz-crystal and, by this, will have very low jitter. Furthermore, the display width will not vary. Procedures to adjust the display clock have to be disabled. 6.5 Improved Interface to External RAM
The SDA 5250M-2 (ROMless version P-MQFP-80-1) can also be used with external RAM, because the pins RD, WR and PSEN are available. Furthermore, optional banking
Semiconductor Group
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1998-10-08
SDA 525X-2
of external XDATA-memory will be possible, controlled by A16, A17, A18. This offers a maximum of flexibility for 128-page-acquisition (see separate application note). 6.6 No UART
As described already in the errata sheet 03/97, release 1.0, the newer versions of the SDA 525x and the SDA 525x-2 will not support a serial port (UART) any more. 6.7 VS Sampling
The internal sampling time of the vertical sync pulse coming from either the VS pin or from the sandcastle signal applied at the pin HS/SC is most important for a stable display. Because the VSYNC inside a TV set is often delayed by external components, the real relation-chip of the VS-phase and the appropriate picture frame may get lost. The sampling time of the SDA 525x is derived from an internal display signal which can only be modified by programming different horizontal offset values (DHD-Register). This has the side-effect that depending on the desired horizontal offset the sampling point is also varied and may show an unstable display. To avoid this dependency, the SDA 525x-2 has a separate register to determine the VS sampling point with respect to the HS pulse, which may be varied over a whole line in steps of 8 s. External components for VS delaying are no more necessary and can be removed if the programmed VS sampling points fits to the external timing between HS, VS and the actual frame (even/odd). To get a better timing resolution in 100 Hz-applications a special bit has been implemented to reduce the intervals between the possible sampling points from 8 to 4 s. The register bits are described below. The following diagram shows the internal VS processing in principle.
HS
VS
Sample Point
Sampled VS
Field
Internal VS
UED11012
Figure 6 Internal VS Processing
Semiconductor Group 15 1998-10-08
SDA 525X-2
Default after reset: 02H (MSB) Bit 7 ... 4 VD -
DAFR1
SFR Address B1H (LSB)
VS100
VD.2
VD.1
VD.0
Must be set to 0 Vertical Delay: Reset value 0010, corresponds to 20 microsecond delay. If VS100 = 0, delay can be set to 4, 12, 20, 28, 36, 44, 52, 60 s If VS100 = 1, delay can be set to 2, 6, 10, 14, 18, 22, 26, 30 s For VD bits selects the sampling mode 0 = 50 Hz 1 = 100 Hz
VS100
Following table gives an overview of the sampling point equivalents of the SDA 525x and the SDA 525x-2 at a selected pixel frequency of 12 MHz. Sample Point in s Equivalent DHD-Setup for SDA 525x (decimal) 4 12 20 28 36 44 52 60 not possible 207 111 15 not possible not possible not possible not possible Equivalent Register Setup for SDA 525x-2 (binary) 000 001 010 011 100 101 110 111
Semiconductor Group
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1998-10-08
SDA 525X-2
6.8
RGB and Blanking Skew
In some applications the BLANK line is delayed by external components and/or special video ICs and thus gets a delay with respect to the RGB- and COR lines which corrupts the display by means of white and black vertical stripes at the beginning and at the end of an OSD menu. To reduce this skew to an acceptable value, the RGB- and COR-lines can be delayed by multiple of a pixel duration. Default after reset: 00H (MSB) Bit 7 ... 2 RGBD1 ... 0 = 00 = 01 = 10 = 11 RGBD.1 DAFR2 SFR Address B2H (LSB) RGBD.0
Must be set to 0 RGB Delay in pixels counts No delay one pixel delay two pixels delay three pixel delay
Semiconductor Group
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1998-10-08
SDA 525X-2
7
Registers of SDA 525x-2
It is very important, that registers not named or marked by "xxxx" here may in no case be used in any way!
Register SDA 525x-2 Name Address Bit7 CDC ACC.7 B.7 CY SP.7 DPH.7 DPL.7 SMOD Bit6 WDT ACC.6 B.6 AC SP.6 DPH.6 DPL.6 PDS Bit5 0 ACC.5 B.5 F0 SP.5 DPH.5 DPL.5 IDLS EM.5 LIN24EN VPSE EM.4 LIN24ST NTSC TEST.4 HD.4 VD.4 IBP DH.1 DCHAP.2 PCLK LANGC.4 DCCP.4 DCRP.4 EO_P30 SCCH.0 BG_MODE EM.3 AVIREN CRIC.1 TEST.3 HD.3 VD.3 TRFI DH.0 DCHAP.1 DVIREN LANGC.3 DCCP:6 DCRP.3 EO_VS FL5MX VPS_TM EM.2 AVIRST CRIC.0 TEST.2 HD.2 VD.2 TRFO BD_24 DCHAP.0 DVIRST LANGC.2 DCCP.5 DCRP.2 SANDC SCCL.2 HG_MOD Bit4 0 ACC.4 B.4 RS1 SP.4 DPH.4 DPL.4 Bit3 0 ACC.3 B.3 RS0 SP.3 DPH.3 DPL.3 Bit2 0 ACC.2 B.2 OV SP.2 DPH.2 DPL.2 DPSEL.2 Bit1 0 ACC.1 B.1 F1 SP.1 DPH.1 DPL.1 DPSEL.1 PDE EM.1 AHIREN ENERT TEST.1 HD.1 VD.1 TRBI BD_1_23 C10 DHIREN LANGC.1 DCCP:7 DCRP.1 LIN9 SCCL.1 DH_MODE Bit0 0 ACC.0 B.0 P SP.0 DPH.0 DPL.0 DPSEL.0 IDLE EM.0 AHIRST TTXE TEST.0 HD.0 VD.0 TRBO BD_0 C7 DHIRST LANGC.0 DCCP.6 DCRP.0 LIN8 SCCL.0 DSDW
Common Functions AFR A6 ACC E0 B F0 PSW D0 SP 81 DPH 83 DPL 82 DPSEL A2 PCON 87
Emulation Functions (Emulation Version only) EMREG FE EM.7 EM.6 Acquisition ACQSIR ACQMS1 ACQMS2 C0 C1 C2 EVENEN OSDACQ EVENST WSSE
Display Generator DHD C3 DVD C4 DTCR C5 DMODE1 C6 DMODE2 C7 TTXSIR C8 LANGC C9 DCCP CA DCRP CB DTIM CC SCCON CE DMOD D6
HD.7 CORI ST_TOP
HD.6 CORO ST_DIS VSY LANGC.6 DC_EN COROS BG_G SCCH.2
HD.5 VD.5 ICRP CON HSY LANGC.5 DCCP:5 BG_B SCCH.1
OSD_64 TRBOS BG_R CORTM
Analog to Digital Converter xxxx ADCON D8 ADDAT D9 AD7 DAPR DA Pulse Width Modulator PWME F8 PWCL F7 PWCH F9 PWCOMP0 F1 PWCOMP1 F2 PWCOMP2 F3 PWCOMP3 F4 PWCOMP4 F5 PWCOMP5 F6 PWCOMP6 FB PWEXT6 FA PWCOMP7 FD PWEXT7 FC Port Functions P0 P1 P2 P3 P4 80 90 A0 B0 E8 E7 PWCL.7 PWCH.7 COMP0.7 COMP1.7 COMP2.7 COMP3.7 COMP4.7 COMP5.7 COMP6.7 EXT6.7 COMP7.7 EXT7.7 P0.7 P1.7 P3.7
xxxx AD6
IADC AD5
BSY AD4
ADM AD3
0 AD2
MX1 AD1
MX0 AD0
E6 PWCL.6 PWCH.6 COMP0.6 COMP1.6 COMP2.6 COMP3.6 COMP4.6 COMP5.6 COMP6.6 EXT6.6 COMP7.6 EXT7.6 P0.6 P1.6 P3.6
E5 PWCL.5 PWCH.5 COMP0.5 COMP1.5 COMP2.5 COMP3.5 COMP4.5 COMP5.5 COMP6.5 EXT6.5 COMP7.5 EXT7.5 P0.5 P1.5 P3.5
E4 PWCL.4 PWCH.4 COMP0.4 COMP1.4 COMP2.4 COMP3.4 COMP4.4 COMP5.4 COMP6.4 EXT6.4 COMP7.4 EXT7.4 P0.4 P1.4 P3.4
E3 PWCL.3 PWCH.3 COMP0.3 COMP1.3 COMP2.3 COMP3.3 COMP4.3 COMP5.3 COMP6.3 EXT6.3 COMP7.3 EXT7.3 P0.3 P1.3 P2.3 P3.3
E2 PWCL.2 PWCH.2 COMP0.2 COMP1.2 COMP2.2 COMP3.2 COMP4.2 COMP5.2 COMP6.2 EXT6.2 COMP7.2 EXT7.2 P0.2 P1.2 P2.2 P3.2
E1 PWCL.1 PWCH.1 COMP0.1 COMP1.1 COMP2.1 COMP3.1 COMP4.1 COMP5.1 COMP6.1 EXT6.1 COMP7.1 EXT7.1 P0.1 P1.1 P2.1 P3.1 P4.1
E0 PWCL.0 PWCH.0 COMP0.0 COMP1.0 COMP2.0 COMP3.0 COMP4.0 COMP5.0 COMP6.0 EXT6.0 COMP7.0 EXT7.0 P0.0 P1.0 P2.0 P3.0 P4.0
Serial Interface SCON 98 SBUF 99 Interrupt Controller IE A8 IP0 A9 IP1 AA IRCON AB Timer 0/1 TMOD TCON TH1 TH0 TL1 TL0 89 88 8D 8C 8B 8A
xxxx xxxx
EA
xxxx xxxx
EADC IP0.6 IP1.6
xxxx xxxx
ETSI IP0.5 IP1.5
xxxx xxxx xxxx IP0.4 IP1.4
xxxx xxxx
ETI IP0.3 IP1.3 EX1R GATE IE1 TH1.3 TH0.3 TL1.3 TL0.3
xxxx xxxx
EX1 IP0.2 IP1.2 EX1F C/T IT1 TH1.2 TH0.2 TL1.2 TL0.2
xxxx xxxx
ET0 IP0.1 IP1.1 EX0R M1 IE0 TH1.1 TH0.1 TL1.1 TL0.1
xxxx xxxx
EX0 IP0.0 IP1.0 EX0F M0 IT0 TH1.0 TH0.0 TL1.0 TL0.0
GATE TF1 TH1.7 TH0.7 TL1.7 TL0.7
C/T TR1 TH1.6 TH0.6 TL1.6 TL0.6
M1 TF0 TH1.5 TH0.5 TL1.5 TL0.5
M0 TR0 TH1.4 TH0.4 TL1.4 TL0.4
continued on next page ...
Semiconductor Group 18 1998-10-08
SDA 525X-2
Register SDA 525x-2 Name Address Bit7 WDTS WDTREL.7 WDTL.7 WDTH.7 Bit6 SWDT WDTREL.6 WDTL.6 WDTH.6 RELL.6 RELH.6 CAPL.6 CAPH.6 PR Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Watchdog Timer WDCON A7 WDTREL 86 WDTL 84 WDTH 85
WDTREL.5 WDTL.5 WDTH.5 RELL.5 RELH.5 CAPL.5 CAPH.5 PLG
WDTREL.4 WDTL.4 WDTH.4 RELL.4 RELH.4 CAPL.4 CAPH.4 REL CB16 MB16
WDTREL.3 WDTL.3 WDTH.3 RELL.3 RELH.3 CAPL.3 CAPH.3 RUN
WDTREL.2 WDTL.2 WDTH.2 RELL.2 RELH.2 CAPL.2 CAPH.2 RISE NB18 IB18
WDTREL.1 WDTL.1 WDTH.1 RELL.1 RELH.1 CAPL.1 CAPH.1 FALL NB17 IB17
WDTREL.0 WDTL.0 WDTH.0 RELL.0 RELH.0 CAPL.0 CAPH.0 SEL NB16 IB16
Infrared Capture-/Compare Timer RELL E1 RELL.7 RELH E2 RELH.7 CAPL E3 CAPL.7 CAPH E4 CAPH.7 IRTCON E5 OV
Memory Management Unit (ROM-less versions only) MEX1 94 CB18 CB17 MEX2 95 MM MB18 MB17 = = Register Bit read-only Register Bit write-only
SF =
xxxx
Register Bit not available and not needed any longer
Differences compared to SDA 525x according to preliminary specification 06/96: 1. The serial interface is not supported any longer. By this, registers SCON and SBUF are no longer available. The "Serial Interrupt Enable Flag" ES of the Interrupt Enable register (Bit 4 of A8) must not be written (default after reset = 0). 2. The functions and bits Prescaler Control (PSC) and ADC sample time (STADC) of the Special Function Register ADCON are not available any more. Bits 7 and 6 of D8 must be 0. 3. The registers following must not be written. The software needs to be checked accordingly. SBUF (99): Bits 0 to 7 SCON (98): Bits 0 to 7 ACQMS2 (C2): Bits 0 to 7 DMODE2 (C7): Bits 5 to 7 ADCON (D8): Bits 6 and 7 IE (A8): Bit 4 The allowed bits of DMODE2, ADCON and IE have to be changed with the commands ANL or ORL.
Semiconductor Group
19
1998-10-08
SDA 525X-2
7.1
Address Space of SDA 525x-2
The registers of the SDA 525x-2 sorted by address are listed in the table following:
Register SDA 525x-2 sorted by address Address decimal 128 129 130 131 132 133 134 135 136 137 138 139 140 141 144 148 149 160 162 166 167 168 169 170 171 176 192 193 194 195 196 197 198 199 200 201 202 203 204 206 208 214 216 217 218 224 225 226 227 228 229 232 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 Name P0 SP DPL DPH WDTL WDTH WDTREL PCON TCON TMOD TL0 TL1 TH0 TH1 P1 MEX1 MEX2 P2 DPSEL AFR WDCON IE IP0 IP1 IRCON P3 ACQSIR ACQMS1 ACQMS2 DHD DVD DTCR DMODE1 DMODE2 TTXSIR LANGC DCCP DCRP DTIM SCCON PSW DMOD ADCON ADDAT DAPR ACC RELL RELH CAPL CAPH IRTCON P4 B PWCOMP0 PWCOMP1 PWCOMP2 PWCOMP3 PWCOMP4 PWCOMP5 PWCL PWME PWCH PWEXT6 PWCOMP6 PWEXT7 PWCOMP7 EMREG Address Bit7 hex 80 P0.7 81 SP.7 82 DPL.7 83 DPH.7 84 WDTL.7 85 WDTH.7 86 WDTREL.7 87 SMOD 88 TF1 89 GATE 8A TL0.7 8B TL1.7 8C TH0.7 8D TH1.7 90 P1.7 94 95 MM A0 A2 A6 CDC A7 WDTS A8 EA A9 AA AB B0 P3.7 C0 EVENEN C1 OSDACQ LIN5EN C2 C3 HD.7 C4 C5 CORI C6 ST_TOP C7 C8 C9 OSD_64 CA CB TRBOS CC BG_R CE CORTM D0 CY D6 xxxx D8 D9 AD7 DA E0 ACC.7 E1 RELL.7 E2 RELH.7 E3 CAPL.7 E4 CAPH.7 E5 OV E8 F0 B.7 F1 COMP0.7 F2 COMP1.7 F3 COMP2.7 F4 COMP3.7 F5 COMP4.7 F6 COMP5.7 F7 PWCL.7 F8 E7 F9 PWCH.7 FA EXT6.7 FB COMP6.7 FC EXT7.7 FD COMP7.7 FE EM.7 Bit6 P0.6 SP.6 DPL.6 DPH.6 WDTL.6 WDTH.6 WDTREL.6 PDS TR1 C/T TL0.6 TL1.6 TH0.6 TH1.6 P1.6 CB18 MB18 Bit5 P0.5 SP.5 DPL.5 DPH.5 WDTL.5 WDTH.5 WDTREL.5 IDLS TF0 M1 TL0.5 TL1.5 TH0.5 TH1.5 P1.5 CB17 MB17 Bit4 P0.4 SP.4 DPL.4 DPH.4 WDTL.4 WDTH.4 WDTREL.4 TR0 M0 TL0.4 TL1.4 TH0.4 TH1.4 P1.4 CB16 MB16 Bit3 P0.3 SP.3 DPL.3 DPH.3 WDTL.3 WDTH.3 WDTREL.3 IE1 GATE TL0.3 TL1.3 TH0.3 TH1.3 P1.3 SF P2.3 0 ETI IP0.3 IP1.3 EX1R P3.3 AVIREN CRIC.1 TEST.3 HD.3 VD.3 TRFI DH.0 DCHAP.1 DVIREN LANGC.3 DCCP:6 DCRP.3 EO_VS FL5MX RS0 VPS_TM ADM AD3 ACC.3 RELL.3 RELH.3 CAPL.3 CAPH.3 RUN B.3 COMP0.3 COMP1.3 COMP2.3 COMP3.3 COMP4.3 COMP5.3 PWCL.3 E3 PWCH.3 EXT6.3 COMP6.3 EXT7.3 COMP7.3 EM.3 Bit2 P0.2 SP.2 DPL.2 DPH.2 WDTL.2 WDTH.2 WDTREL.2 IT1 C/T TL0.2 TL1.2 TH0.2 TH1.2 P1.2 NB18 IB18 P2.2 DPSEL.2 0 EX1 IP0.2 IP1.2 EX1F P3.2 AVIRST CRIC.0 TEST.2 HD.2 VD.2 TRFO BD_24 DCHAP.0 DVIRST LANGC.2 DCCP.5 DCRP.2 SANDC SCCL.2 OV HG_MOD 0 AD2 ACC.2 RELL.2 RELH.2 CAPL.2 CAPH.2 RISE B.2 COMP0.2 COMP1.2 COMP2.2 COMP3.2 COMP4.2 COMP5.2 PWCL.2 E2 PWCH.2 EXT6.2 COMP6.2 EXT7.2 COMP7.2 EM.2 Bit1 P0.1 SP.1 DPL.1 DPH.1 WDTL.1 WDTH.1 WDTREL.1 PDE IE0 M1 TL0.1 TL1.1 TH0.1 TH1.1 P1.1 NB17 IB17 P2.1 DPSEL.1 0 ET0 IP0.1 IP1.1 EX0R P3.1 AHIREN ENERT TEST.1 HD.1 VD.1 TRBI BD_1_23 C10 DHIREN LANGC.1 DCCP:7 DCRP.1 LIN9 SCCL.1 F1 DH_MODE MX1 AD1 ACC.1 RELL.1 RELH.1 CAPL.1 CAPH.1 FALL P4.1 B.1 COMP0.1 COMP1.1 COMP2.1 COMP3.1 COMP4.1 COMP5.1 PWCL.1 E1 PWCH.1 EXT6.1 COMP6.1 EXT7.1 COMP7.1 EM.1 Bit0 P0.0 SP.0 DPL.0 DPH.0 WDTL.0 WDTH.0 WDTREL.0 IDLE IT0 M0 TL0.0 TL1.0 TH0.0 TH1.0 P1.0 NB16 IB16 P2.0 DPSEL.0 0 EX0 IP0.0 IP1.0 EX0F P3.0 AHIRST TTXE TEST.0 HD.0 VD.0 TRBO BD_0 C7 DHIRST LANGC.0 DCCP.6 DCRP.0 LIN8 SCCL.0 P DSDW MX0 AD0 ACC.0 RELL.0 RELH.0 CAPL.0 CAPH.0 SEL P4.0 B.0 COMP0.0 COMP1.0 COMP2.0 COMP3.0 COMP4.0 COMP5.0 PWCL.0 E0 PWCH.0 EXT6.0 COMP6.0 EXT7.0 COMP7.0 EM.0
WDT SWDT EADC IP0.6 IP1.6 P3.6 EVENST WSSE LIN5ST HD.6 CORO ST_DIS VSY LANGC.6 DC_EN COROS BG_G SCCH.2 AC
0 ETSI IP0.5 IP1.5 P3.5 LIN24EN VPSE HD.5 VD.5 ICRP CON HSY LANGC.5 DCCP:5 BG_B SCCH.1 F0 IADC AD5 ACC.5 RELL.5 RELH.5 CAPL.5 CAPH.5 PLG B.5 COMP0.5 COMP1.5 COMP2.5 COMP3.5 COMP4.5 COMP5.5 PWCL.5 E5 PWCH.5 EXT6.5 COMP6.5 EXT7.5 COMP7.5 EM.5
0
xxxx IP0.4 IP1.4
P3.4 LIN24ST NTSC TEST.4 HD.4 VD.4 IBP DH.1 DCHAP.2 PCLK LANGC.4 DCCP.4 DCRP.4 EO_P30 SCCH.0 RS1 BG_MODE BSY AD4 ACC.4 RELL.4 RELH.4 CAPL.4 CAPH.4 REL B.4 COMP0.4 COMP1.4 COMP2.4 COMP3.4 COMP4.4 COMP5.4 PWCL.4 E4 PWCH.4 EXT6.4 COMP6.4 EXT7.4 COMP7.4 EM.4
xxxx AD6
ACC.6 RELL.6 RELH.6 CAPL.6 CAPH.6 PR B.6 COMP0.6 COMP1.6 COMP2.6 COMP3.6 COMP4.6 COMP5.6 PWCL.6 E6 PWCH.6 EXT6.6 COMP6.6 EXT7.6 COMP7.6 EM.6
The address space for MOVX is distributed as follows: 0000 - 7FFF: 8000 - 9FFF: A000 - BFFF: C000 - DFFF: E000 - E7FF: reserved for external SRAM (32k) reserved for future extensions (8k) read access to Pixel-ROM via MOVX-command (8k) display-chapters 1 to 8 (8k) display-chapters 9 and 10 (2k) (optional)
20 1998-10-08
Semiconductor Group
SDA 525X-2
E800 F400 F800 FC008
F3FF: F7FF: FBFF: FFFF:
reserved for future extensions (3k) VBI buffer (1k) CPU RAM (1k) reserved for future extensions (1k)
Software Changes
All calls of the subroutine "adjust_horizontal" (inside the module IFRDEMO.C51 on the Firmware Demo Disk) must be removed from the external controller software. This routine was developed to adjust the display to the middle of the screen according to tolerances of the LC-oscillator. This oscillator is not used any more. The pixel clock is derived from the single external crystal. However, customers who are using SDA 525x-2 without emulating with SDA 5250-2 or 5250M-2 need to use some adjustment routine for their first circuits. As soon as the correct adjustment is known, it can be used as a fixed value for initialization or for future software. Furthermore, due to some changes in the special function registers, the software needs to be checked. The changes are in detail:
1. The serial interface is not supported any longer. By this, registers SCON and SBUF are no longer available. The "Serial Interrupt Enable Flag" ES of the Interrupt Enable register (Bit 4 of A8) must not be written (default after reset = 0). 2. The functions and bits Prescaler Control (PSC) and ADC sample time (STADC) of the Special Function Register ADCON are not available any more. Bits 7 and 6 of D8 must be 0. 3. The registers following must not be written. The software needs to be checked accordingly. SBUF (99): Bits 0 to 7 SCON (98): Bits 0 to 7 ACQMS2 (C2): Bits 0 to 7 DMODE2 (C7): Bits 5 to 7 ADCON (D8): Bits 6 and 7 IE (A8): Bit 4 The allowed bits of DMODE2, ADCON and IE have to be changed with the commands ANL or ORL.
9 Timing
Although the frequency of the external quarz is now 6 MHz, all the internal timings correspond to that of the SDA525x with an 18 MHz quarz. This is achieved by an internal PLL.
Semiconductor Group
21
1998-10-08
SDA 525X-2
10
Application Circuit
Use of SDA 525x-2 (Design Step B) as replacement for SDA 525x: (For more detailed application hints refer to 'TVText Design Guide V1.5')
EPROM D A
33 pF
D0-7 A0-18 XTAL1 P0.0-7 P1.0-7 P2.0-7 XTAL2 RST P3.0-7 CVBS
8 8 4 8
I/O Port 0 (Open-Drain) I/O Port 1 (PWM) Input Port 2 (ADC) I/O Port 3 330 nF CVBS 1 M
6 MHz 33 pF
10 k +5 V
10 F SDA 525X-2 R G B FIL3
2.7 k
33 nF
VDDA
Sandcastle 10 H
3 x 220 Blank COR REF
SC
VDD
100 nF
10 F
+5 V
VDDA
VSS VSSA
100 nF 10 nF 27 k 10 F 10 H +5 V Only ROMless Versions
UED09862
Figure 7
Semiconductor Group
22
1998-10-08
SDA 525X-2
Necessary changes compared to SDA 525x according to preliminary data sheet 1998-02-18 are:
1. RGB-outputs deliver a current instead of a voltage. Any voltage divider can be replaced by a single resistor. This resistor will have a different dimension. The nominal output current is 5.2 mA with a resistor of 27 k at the IREF-pin. 2. Instead of FIL1SLC/FIL2SLC/FIL3SLC only FIL3 is needed with changed external device dimensions. Former FIL1SLC and FIL2SLC remain "not connected". For best slicer performance FIL3 is tied to VDDA. FIL3 may be tied to VSSA, if a ripple free VDDA is available. 3. LCIN and LCOUT are not needed any more and are not connected or used for RD and WR in the P-MQFP-80-1-package, respectively. 4. P-MQFP-80-1 now has RD (Pin 52), WR (53) and PSEN (1) Pins to connect external RAM. 5. The 18-MHz-crystal is replaced by a 6-MHz type.
`n. c.' = `not connected' means: Pins must be left open.
Semiconductor Group
23
1998-10-08


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